Copper Fluoborate

Chemistry & Physical Properties

Copper(II) tetrafluoroborate, formula Cu(BF4)2, formula weight 237.16 g/mol (anhydrous). Supplied as a clear blue-green aqueous solution at 50% concentration. Density approximately 1.65 g/cm3. The aquated species is [Cu(H2O)6]2+ paired with BF4- anions. Aqueous pH typically 0-2. Hexahydrate solid form (Cu(BF4)2·6H2O) also exists.

Standards & Specifications

Industrial plating-grade Cu(BF4)2 conforms to ASTM B281 (Standard Specification for Copper Electroplated Deposits) and IPC-4101 (Specification for Base Materials for Rigid and Multilayer Printed Boards). Reference plating-bath chemistry described in Lowenheim, "Modern Electroplating". Pharmacopeial grades not specified.

Regulatory & Transport Profile

CAS 14708-99-7. UN 3260 — Class 8 (Corrosive), PG II/III depending on concentration. GHS pictograms: GHS05 (corrosive), GHS07 (harmful), GHS09 (environmental hazard, harmful to aquatic life). REACH registered. TSCA listed. RoHS — copper compounds are not restricted.

Available Grades

Frequently Asked Questions

How does it compare to copper sulphate plating?

Cu(BF4)2 baths give better throwing power and higher tolerable current density (10-30 A/dm2) than CuSO4 acid baths — preferred for PCB through-hole plating where uniform deposition is critical.

Is it compatible with copper anodes?

Yes — phosphorized copper anodes are standard for fluoborate copper baths.

What are the typical bath operating conditions?

pH 0-2, temperature 20-50°C, with addition of brighteners and levellers as needed for the specific deposit requirement.

How is spent bath disposed?

Copper recovery via electrowinning is straightforward, then the residual fluoborate is treated for fluoride/boron removal before discharge.

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Authoritative References & External Data Sources

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